RAVEN reviewed source reporting
Technology · World
NIST Researchers Develop Photonic Chip Packaging That Can Withstand Extreme Environments
Originally published by National Institute of Standards and Technology ·
The advance could allow these technologies to operate in deep-space probes, inside nuclear reactors, in ultrahigh vacuum systems, and at temperatures both near absolute zero and in scorchingly hot industrial settings.
Source provenance
- Source
- National Institute of Standards and Technology
- Issuing body
- National Institute of Standards and Technology
- RAVEN publication
- Human-reviewed source selection
Share this page
RAVEN loads no social-media scripts or tracking pixels on this page. A social platform is contacted only after you choose it.